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Mechanical Engineering
SMASH Lab
Smart Materials and Shock Lab

Publications

Papers

Aldo Chipana, Jeffrey R Hill, & Christopher R Dillon. "In Situ Actuation of Shape Memory Alloy Using Focused Ultrasound." Proceedings of the ASME 2023 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. ASME 2023 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. Austin, Texas, USA. September 11–13, 2023. https://doi.org/10.1115/SMASIS2023-110681
 
J. Stansfield, C. Boll, J. Hill, “Micro-Beaded Encapsulants for Electronics Packaging”, Proceedings of 92nd Shock and Vibration Symposium, May 2023

Presentations

A. Chipana, J. Moore, M. Hancock, S. Sanderson, J. Hill, C. Dillon, “Investigating the feasibility of Focused Ultrasound (FUS) actuation of Shape Memory Alloy (SMA)”, Utah Conference on Undergraduate Research”, Orem, UT, February 16, 2024.

H. Denning, A. Bullinger, J. Hill, “Novel Method of Tensegrity Construction via Acoustic String Tuning”, Utah Conference on Undergraduate Research”, Orem, UT, February 16, 2024.

H. Denning, S. Thompson, J. Hill, “Exploration of Bi-Stable Tensegrity Models with Differing Stiffness Modes”, Utah Conference on Undergraduate Research”, Orem, UT, February 16, 2024.

S. Stearman, B. Crapo, A. Trujillo, J. Hill, “Arm Modeling in Preparation for Wearable Mobility-Enhancing Elbow Brace”, Utah Conference on Undergraduate Research”, Orem, UT, February 16, 2024.

J. Moore, J. Hill, “Investigation of the Impact of Heat Treatment on Nitinol Wires”, Utah Conference on Undergraduate Research”, Orem, UT, February 16, 2024.

S. Stearman, B. Crapo, A. Trujillo, J. Hill, “Arm Modeling in Preparation for Wearable Mobility-Enhancing Elbow Brace”, BYU Biomedical Engineering Conference, Provo, UT, January 25, 2024.

A. Chen, C. Boll, D. Stefan, R. Andrew, J. Hill, “Electronic Survivability and Response of Microbeaded Encapsulants Under Shock”, 93rd Shock and Vibration Symposium, Atlanta, GA, Sept. 24-28, 2023.

J. Stansfield, C. Boll, J. Hill, “Micro-Beaded Encapsulants for Electronics Packaging”,  92nd Shock and Vibration Symposium, Denver, CO, Sept 18-22, 2022.